G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title Use of this Practice is

Use of this Practice is based upon the application of several referenced standards in a prescribed sequence to reveal and count microscopic defects or structures

SEMI M70 — Practice for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness

epitaxial or other layer condition and for monitoring thermal and mechanical effects on the sori of wafers during device processing

1  This Guide provides the tools to describe individual wafers in a 3DS-IC process

The Test Method is based on laser triangulation sensors which measure the position of the laser beam it projected onto a wafer surface and the saw marks are oriented perpendicular to the direction of wafer transport

G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title Use of this Practice isThis document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method