MF067300 - SEMI MF673 - Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge Revision:SEMI MF673-0317 - Superseded 1 — Mechanical Specification for

1 — Mechanical Specification for FOUPs Used to Transport and Store 300 mm Wafers

Referenced SEMI Standards (purchase separately)

この規格はまた，混合された材料からの熔融物に対するガイドラインとして使われるかもしれないが，混合材料を規定することを意図していない。

The scope of this Document is limited to the definition of principles for handling reticles and other EES items within a specially designated controlled environment and recommendation of an appropriate level of electric field to maintain within that environment

in the order given below

MF067300 - SEMI MF673 - Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge Revision:SEMI MF673-0317 - Superseded 1 — Mechanical Specification forResistivity is a primary quantity for characterization and specification of material used for semiconductor electronic devices. Sheet resistance is a primary quantity for characterization, specification, and monitoring of thin film fabrication processes. This Test Method outlines the principles of eddy current measurements as they relate to semiconductor substrates and certain thin films fabricated on such substrates as well as requirements for