Reshaping Moore's Law with Advanced Packaging 8/3/26 StdPbc-0924 3 The model contained in

3  The model contained in this Specification documents features of the equipment structure considered necessary for more than one (current or future) Equipment Communication Standards

This Specification is a guideline for the stamping manufacture of leadframes for plastic molded dual-in-line semiconductor packages

and many more

values are based on test sample weight

A guide defining a systems approach to power conditioning is needed for semiconductor and flat panel display (FPD) facilities

Reshaping Moore's Law with Advanced Packaging 8/3/26 StdPbc-0924 3 The model contained inReshaping Moores Law Dates & Times August 3rd, 2026 8: 30 am 5: 00pm GMT +8 Location Virtual Pricing Members: $599 Non Members: $649 Course Description This workshop explores how advanced packaging is redefining the trajectory of Moore's Law. Participants will gain insight into cutting edge approaches, such as heterogeneous integration and chiplet architectures, that enable continued performance growth beyond traditional scaling limits. We will delve